SANTA CLARA, California .– (COMMERCIAL LINE) – TSMC (TWSE: 2330, NYSE: TSM) today unveiled the latest innovations in its advanced logic, specialty and 3D IC technologies at the company’s North America Technology Symposium 2022, featuring the next generation state-of-the-art N2 process powered by nanosheet transistors and the unique FinFlex™ N3 and N3E process technologies debut.
Picking up as an in-person event after being held online for the past two years, the North American Symposium in Santa Clara, California, will kick off a series of technology symposiums around the world in the coming months. The Symposiums also feature an Innovation Zone highlighting the achievements of TSMC’s emerging start-up customers.
“We live in a rapidly changing, supercharged digital world where the demand for computational power and energy efficiency is growing faster than ever, creating unprecedented opportunities and challenges for the semiconductor industry,” said Dr. CC Wei, CEO of TSMC. “The innovations we will present at our Technology Symposiums demonstrate TSMC’s technology leadership and our commitment to support our customers during this exciting period of transformation and growth.”
The main technologies highlighted at the Symposium include:
TSMC FinFlex™ for N3 and N3E – TSMC’s industry-leading N3 technology, set to go into series production later in 2022, will feature the revolutionary TSMC FinFlex™ architectural innovation that offers unprecedented flexibility for designers. The TSMC FinFlex™ the innovation offers the choice of several standard cells with a 3-2 fin configuration for ultra performance, a 2-1 pin configuration for the best power efficiency and transistor density, and a 2-2 fin configuration that provides balance between the two for efficient performance. With TSMC FinFlex™ architecture, customers can create system-on-chip designs optimized for their needs with functional blocks that implement the best optimized fin configuration for desired performance, power and target area and integrated on the same chip. For more information on FinFlex, visit N3.TSMC.COM.
N2 technology – TSMC’s N2 technology represents another notable advance over the N3, with a 10-15% speed improvement at the same power or a 25-30% power reduction at the same speed, ushering in a new era of efficient performance. N2 will feature nanosheet transistor architecture to deliver a comprehensive performance and energy efficiency improvement to enable next generation product innovations from TSMC customers. The N2 technology platform includes a high-performance variant in addition to the mobile computing baseline version, as well as complete chiplet integration solutions. N2 is expected to start production in 2025.
Expanding Ultra Low Power Platform – Building on the success of N12e technology announced at Technology Symposium 2020, TSMC is developing N6e, the next evolution in process technology optimized to deliver the computing power and energy efficiency required by edge AI and IoT devices. N6e will be based on TSMC’s advanced 7nm process and is expected to have three times the logical density of N12e. It will serve as part of TSMC’s Ultra-Low Power Platform, a comprehensive portfolio of logic, RF, analog, embedded non-volatile memory and power management ICs for applications in artificial intelligence and the Internet of Things.
TSMC 3D fabric™ 3D Silicon Stacking Solutions – TSMC introduces two revolutionary customer applications of the TSMC-SoIC™ chip stacking solution:
World’s first SoIC-based CPU that uses Chip-on-Wafer (CoW) technology to stack SRAM as a level 3 cache
An innovative intelligence processing unit stacked atop a deep-trench condenser using Wafer-on-Wafer (WoW) technology.
With N7 chips already in production for both CoW and WoW, support for N5 technology is planned for 2023. To meet customer demand for SoICs and other TSMCs 3DFabric™ System Integration Services, the world’s first fully automated 3DFabric factory will begin production in the second half of 2022.
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The company supports a thriving ecosystem of global customers and works with industry-leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations in Asia, Europe and North America, TSMC serves as a committed corporate citizen around the world.
TSMC implemented 291 distinct process technologies and produced 12,302 products for 535 customers in 2021 providing the widest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5 nanometer manufacturing capability, the most advanced semiconductor process technology available in the world. The company is headquartered in Hsinchu, Taiwan. For more information, visit https://www.tsmc.com.